Carbon steel core diamond wires specifications
+
  • Carbon steel core diamond wires specifications

Product specification

Carbon steel core diamond wires specifications

Application scenariosSize (µm)OD (µm)Breaking force (N)
Silicon slicing2642-45≥4.7
2844-47≥5.3
3046-49≥5.9
3349-52≥6.6
3551-54≥6.9
3854-57≥7.8
4057-60≥8
4359-62≥9
5568-71≥11.5
5870-73≥12.5
6072-75≥13.2
Magnetic material slicing Semiconductor silicon slicing Glass-ceramic slicing100100-115≥23
120118-133≥27
145140-160≥30
175170-190≥40
Sapphire, magnetic material slicing200195-210≥55
210205-225≥60
220205-225≥72
230215-235≥72
Zirconia, sapphire,SiC, magnetic material slicing250230-250≥85
Silicon bricking Zirconia, ceramic materials, jade cutting300290-345≥160
320300-345≥160
Silicon and jade bricking and cropping350340-375≥180
Cutting stone450450-500≥280
500510-560≥340
550540-600≥390

Remarks :OD can be customized.

 

Application area

Product advantage

· Reduce cutting cost

· Improve TTV

· Improve Warp

· The cutting surface is smoother

· The cutting accuracy is higher

· Environment friendly

Carbon steel core diamond wires specifications
+
  • Carbon steel core diamond wires specifications

Carbon steel core diamond wires specifications

Carbon steel core diamond wire is made of steel wire as the base material. It is mainly used in the photovoltaic industry as an important tool for silicon wafer cutting. The specifications of DIALINE carbon steel diamond wire cover 26 microns-550 microns.


Get In Touch

Please leave your contact information and we will contact you as soon as possible!

Submit